Lam Research acquires SEMSYSCO; adds advanced packaging capabilities

The American wafer fabrication gear maker Lam Study has accomplished the acquisition of Austria based mostly SEMSYSCO, a global company of moist processing semiconductor equipment, for an undisclosed amount. With this acquisition, Lam provides capabilities in sophisticated packaging, suitable for leading-edge logic chips and chiplet-based mostly alternatives for higher-general performance computing (HPC), artificial intelligence (AI) and other knowledge-intensive purposes to its portfolio.

“The strategic acquisition of SEMSYSCO furthers our dedication to aid chipmakers handle their emerging engineering challenges, incorporating deep abilities in advanced substrates and packaging processes,” said Tim Archer, president and chief executive officer at Lam Research. “With impressive offerings and major-edge study and enhancement in packaging, Lam is well-positioned to aid our consumers as they scale to future chiplet-based mostly systems,” he additional.

The acquisition of SEMSYSCO broadens Lam’s packaging choices, bringing a portfolio of modern cleaning and plating abilities for chiplet-to-chiplet or chiplet-to-substrate heterogeneous integration. This consists of guidance of lover-out panel-level packaging, a video game-altering course of action in which chips or chiplets are slash from a huge, rectangular substrate sheet a number of instances the dimension of a standard silicon wafer. This solution allows chipmakers to noticeably raise generate and minimize squander.

“Packaging performs an important job in extending Moore’s Law and enabling foreseeable future leadership merchandise with better levels of process in package integration. New substrate-primarily based panel-stage strategies are essential to price-properly noticing the substantial-effectiveness chiplet-dependent solutions essential for the electronic globe,” stated Keyvan Esfarjani, main international operations officer at Intel Company. “We are pleased to develop our deep, prolonged-standing connection with Lam to contain advanced cleaning and plating processes in the new panel variety factor.”

With the acquisition of SEMSYSCO, Lam also gains a state-of-the-artwork R&D facility in Austria centered on future-generation substrates and heterogeneous packaging, broadening the firm’s powerful enhancement capabilities in Europe and introducing a sixth lab in Lam’s world-wide network. In addition, it provides to Lam new and expanded relationships with chipmakers and fabless customers.

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